{"id":54716,"date":"2026-04-30T13:21:00","date_gmt":"2026-04-30T06:21:00","guid":{"rendered":"https:\/\/thaipropertynews.com\/feeds\/?p=54716"},"modified":"2026-04-30T13:21:00","modified_gmt":"2026-04-30T06:21:00","slug":"leading-the-ai-wave-er-brings-next-gen-laser-and-plasma-tech-to-semicon-sea-2026","status":"publish","type":"post","link":"https:\/\/thaipropertynews.com\/feeds\/?p=54716","title":{"rendered":"Leading the AI Wave: E&amp;R Brings Next-Gen Laser and Plasma Tech to SEMICON SEA 2026"},"content":{"rendered":"<p><span class=\"legendSpanClass\">KAOHSIUNG<\/span>, <span class=\"legendSpanClass\">April 30, 2026<\/span> \/PRNewswire\/ &#8212;\u00a0E&amp;R Engineering (8027.TW) will showcase advanced laser and plasma solutions at SEMICON Southeast Asia 2026 next week. Targeting critical demands in <b>AI, CPO, and next-generation manufacturing<\/b>, E&amp;R is partnering with <b>Horng Terng Automation (HTA)<\/b> and <b>Group Up Industrial (GP)<\/b> to deliver a fully integrated turnkey solution:<\/p>\n<ul type=\"disc\">\n<li><b>E&amp;R Engineering:<\/b> Leading-edge Laser and Plasma processing solutions.<\/li>\n<li><b>Horng Terng Automation (HTA):<\/b> Expertise in integrated thermal interface material (TIM) solutions, incorporating visual AOl inspection technology.<\/li>\n<li><b>Group Up Industrial (GP):<\/b> Laminator, oven, and coater solutions have been successfully implemented into advanced packaging markets\u2014including FOPLP, FOWLP, and TGV\u2014through seamless automated integration.<\/li>\n<\/ul>\n<p><b>E&amp;R&#8217;s 2026 Technology Highlights:<\/b><\/p>\n<p><b>Laser and Plasma Advanced Packaging<\/b><\/p>\n<ul type=\"disc\">\n<li>High-precision laser drilling for 2.5D\/3D ICs (\u00b15 \u03bcm, B\/T ratio up to 90%)<\/li>\n<li>Multi-beam laser marking (\u00b125 \u03bcm accuracy, high throughput)<\/li>\n<li>Controlled thermal laser cutting<\/li>\n<li>Microwave or RF Plasma cleaning for pre-underfill, surface activation and Redox<\/li>\n<li>Hybrid plasma solution for high-efficiency dry etching solution<\/li>\n<\/ul>\n<p><b>Automation Integration Service (AIS)<\/b><\/p>\n<p>Leveraging 30+ years of experience, E&amp;R delivers custom automation meeting complex CIM and factory requirements. By integrating multi-vendor process modules into a unified, high-efficiency system through simulation-driven modeling, we provide a unified UI and a single service window. Our dedicated R&amp;D and sales teams ensure direct engagement and responsive technical support for every project.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\">\n<p><a href=\"https:\/\/mma.prnasia.com\/media2\/2969926\/image.html\" target=\"_blank\" rel=\"nofollow\"><img decoding=\"async\" src=\"https:\/\/mma.prnasia.com\/media2\/2969926\/image.jpg?p=medium600\" title=\"E&amp;R's Automation Integration Service (AIS)\" alt=\"E&amp;R's Automation Integration Service (AIS)\" \/><\/a><br \/><span>E&amp;R&#8217;s Automation Integration Service (AIS)<\/span><\/p>\n<\/div>\n<p><b>FOPLP \u2013 Fan-Out Panel Level Packaging (700 \u00d7 700 mm)<\/b><\/p>\n<p>E&amp;R&#8217;s total solution supports large panel processes including laser marking, laser cutting, laser descum, plasma cleaning, and post-drill de-smear, with a remarkable warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching solutions for separation of glass carrier and panel.<\/p>\n<p>Join us at SEMICON SEA 2026 to see how E&amp;R, HTA, and Group Up are driving the future of semiconductor manufacturing \u2014 with more precise, efficient, and integrated solutions.<\/p>\n<p><b>Booth Information<\/b><\/p>\n<ul type=\"disc\">\n<li><b>Booth Number:<\/b> #1452<\/li>\n<li><b>Location:<\/b> Malaysia International Trade and Exhibition Centre (MITEC)<\/li>\n<li><b>Dates:<\/b> May 5-7, 2026<\/li>\n<li><b>E&amp;R Website: <\/b><a href=\"https:\/\/en.enr.com.tw\/\" target=\"_blank\" rel=\"nofollow\">https:\/\/en.enr.com.tw\/<\/a><\/li>\n<\/ul>\n<div class=\"PRN_ImbeddedAssetReference\">  <\/div>","protected":false},"excerpt":{"rendered":"<p><!-- wp:html --><\/p>\n<p><span class=\"legendSpanClass\">KAOHSIUNG<\/span>, <span class=\"legendSpanClass\">April 30, 2026<\/span> \/PRNewswire\/ &#8212;\u00a0E&amp;R Engineering (8027.TW) will showcase advanced laser and plasma solutions at SEMICON Southeast Asia 2026 next week. Targeting critical demands in <b>AI, CPO, and next-generation manufacturing<\/b>, E&amp;R is partnering with <b>Horng Terng Automation (HTA)<\/b> and <b>Group Up Industrial (GP)<\/b> to deliver a fully integrated turnkey solution:<\/p>\n<ul type=\"disc\">\n<li><b>E&amp;R Engineering:<\/b> Leading-edge Laser and Plasma processing solutions.<\/li>\n<li><b>Horng Terng Automation (HTA):<\/b> Expertise in integrated thermal interface material (TIM) solutions, incorporating visual AOl inspection technology.<\/li>\n<li><b>Group Up Industrial (GP):<\/b> Laminator, oven, and coater solutions have been successfully implemented into advanced packaging markets\u2014including FOPLP, FOWLP, and TGV\u2014through seamless automated integration.<\/li>\n<\/ul>\n<p><b>E&amp;R&#8217;s 2026 Technology Highlights:<\/b><\/p>\n<p><b>Laser and Plasma Advanced Packaging<\/b><\/p>\n<ul type=\"disc\">\n<li>High-precision laser drilling for 2.5D\/3D ICs (\u00b15 \u03bcm, B\/T ratio up to 90%)<\/li>\n<li>Multi-beam laser marking (\u00b125 \u03bcm accuracy, high throughput)<\/li>\n<li>Controlled thermal laser cutting<\/li>\n<li>Microwave or RF Plasma cleaning for pre-underfill, surface activation and Redox<\/li>\n<li>Hybrid plasma solution for high-efficiency dry etching solution<\/li>\n<\/ul>\n<p><b>Automation Integration Service (AIS)<\/b><\/p>\n<p>Leveraging 30+ years of experience, E&amp;R delivers custom automation meeting complex CIM and factory requirements. By integrating multi-vendor process modules into a unified, high-efficiency system through simulation-driven modeling, we provide a unified UI and a single service window. Our dedicated R&amp;D and sales teams ensure direct engagement and responsive technical support for every project.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\">\n<p><a href=\"https:\/\/mma.prnasia.com\/media2\/2969926\/image.html\" target=\"_blank\" rel=\"nofollow\"><img decoding=\"async\" src=\"https:\/\/mma.prnasia.com\/media2\/2969926\/image.jpg?p=medium600\" title=\"E&amp;R's Automation Integration Service (AIS)\" alt=\"E&amp;R's Automation Integration Service (AIS)\" \/><\/a><br \/><span>E&amp;R&#8217;s Automation Integration Service (AIS)<\/span><\/p>\n<\/div>\n<p><b>FOPLP \u2013 Fan-Out Panel Level Packaging (700 \u00d7 700 mm)<\/b><\/p>\n<p>E&amp;R&#8217;s total solution supports large panel processes including laser marking, laser cutting, laser descum, plasma cleaning, and post-drill de-smear, with a remarkable warpage control up to 16 mm. The process is further enhanced with laser debonding and plasma dry etching solutions for separation of glass carrier and panel.<\/p>\n<p>Join us at SEMICON SEA 2026 to see how E&amp;R, HTA, and Group Up are driving the future of semiconductor manufacturing \u2014 with more precise, efficient, and integrated solutions.<\/p>\n<p><b>Booth Information<\/b><\/p>\n<ul type=\"disc\">\n<li><b>Booth Number:<\/b> #1452<\/li>\n<li><b>Location:<\/b> Malaysia International Trade and Exhibition Centre (MITEC)<\/li>\n<li><b>Dates:<\/b> May 5-7, 2026<\/li>\n<li><b>E&amp;R Website: <\/b><a href=\"https:\/\/en.enr.com.tw\/\" target=\"_blank\" rel=\"nofollow\">https:\/\/en.enr.com.tw\/<\/a><\/li>\n<\/ul>\n<div class=\"PRN_ImbeddedAssetReference\">  <\/div>\n<p><!-- \/wp:html --><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"rop_custom_images_group":[],"rop_custom_messages_group":[],"rop_publish_now":"initial","rop_publish_now_accounts":[],"rop_publish_now_history":[],"rop_publish_now_status":"pending","footnotes":""},"categories":[5,7],"tags":[],"class_list":["post-54716","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-cision-pr-newswire","category-cision-pr-newswire-en"],"_links":{"self":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts\/54716","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=54716"}],"version-history":[{"count":0,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts\/54716\/revisions"}],"wp:attachment":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=54716"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=54716"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=54716"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}