{"id":51273,"date":"2026-03-17T13:48:00","date_gmt":"2026-03-17T06:48:00","guid":{"rendered":"https:\/\/thaipropertynews.com\/feeds\/?p=51273"},"modified":"2026-03-17T17:41:23","modified_gmt":"2026-03-17T10:41:23","slug":"linktel-founding-member-of-xpo-msa-to-debut-12-8t-liquid-cooled-module-at-ofc-2026","status":"publish","type":"post","link":"https:\/\/thaipropertynews.com\/feeds\/?p=51273","title":{"rendered":"Linktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026"},"content":{"rendered":"

LOS ANGELES<\/span><\/span>, March 17, 2026<\/span><\/span> \/PRNewswire\/ — Linktel Technologies, a globally recognized company in optical transceiver development and manufacturing, today announced its 12.8T XPO liquid-cooled optical module will be featured in live demonstrations at OFC 2026. Designed for the escalating density and thermal demands of next-generation data centers, the 64-channel XPO module supports scale-up, scale-out, scale-across, and metro-reach configurations with high efficiency for AI clusters.<\/p>\n

The XPO form factor achieves a front-panel density of 204.8 Tbps per rack unit\u2014a fourfold increase over current 1.6T OSFP implementations. This breakthrough enables a 75% reduction in switch footprint, optimizing space and power utilization as AI clusters scale to massive GPU counts.<\/p>\n

Technical Specifications & Key Innovations:
<\/b>Universal Interconnect: <\/b>Native compatibility with DR, FR, LR, SR, and ZR\/ZR+ standards across LPO, LRO, FRT, DSP architectures.
Advanced Thermal Management: <\/b>Features an integrated cold plate in a “belly-to-belly” configuration, reducing internal temperatures by 20\u00b0C to 25\u00b0C and supporting stable operation up to 400W.
Time to Market: <\/b>Utilizing existing photonics and silicon chips to ensure production readiness without requiring new specialized chips.<\/p>\n

“The evolution of AI workloads requires a fundamental shift in bandwidth and thermal density,” said Richard Xiao<\/span>, VP of Product Marketing at Linktel Technologies. “As a founding member of the XPO MSA, Linktel is proud to lead the definition of these new standards. The 12.8T XPO series shows Linktel’s commitment to delivering flexible, high-performance, and reliable optical solutions for next-generation AI architectures.”<\/p>\n

OFC 2026 Demonstration
<\/b>At Booth #1219, Linktel will demonstrate the 12.8T Liquid-Cooled XPO along with 200G\/lane 1.6T modules, 400G\/lane Optical Engines, and Lightwave Innovation Award-winning Dispersion Management modules.<\/p>\n

About Linktel Technologies
<\/b>Linktel Technologies, with international operation centers and customer service offices in USA, Singapore<\/span>, Malaysia<\/span>, and China<\/span>, provides high-quality products for high-speed optical I\/O connectivity including high speed pluggable transceivers, optical engines, and ODM\/JDM services.<\/p>\n

For more information, visit www.linktel.com<\/span><\/a>.<\/p>\n

\u00a0<\/p>","protected":false},"excerpt":{"rendered":"

<\/p>\n

LOS ANGELES<\/span><\/span>, March 17, 2026<\/span><\/span> \/PRNewswire\/ — Linktel Technologies, a globally recognized company in optical transceiver development and manufacturing, today announced its 12.8T XPO liquid-cooled optical module will be featured in live demonstrations at OFC 2026. Designed for the escalating density and thermal demands of next-generation data centers, the 64-channel XPO module supports scale-up, scale-out, scale-across, and metro-reach configurations with high efficiency for AI clusters.<\/p>\n

The XPO form factor achieves a front-panel density of 204.8 Tbps per rack unit\u2014a fourfold increase over current 1.6T OSFP implementations. This breakthrough enables a 75% reduction in switch footprint, optimizing space and power utilization as AI clusters scale to massive GPU counts.<\/p>\n

Technical Specifications & Key Innovations:
<\/b>Universal Interconnect: <\/b>Native compatibility with DR, FR, LR, SR, and ZR\/ZR+ standards across LPO, LRO, FRT, DSP architectures.
Advanced Thermal Management: <\/b>Features an integrated cold plate in a “belly-to-belly” configuration, reducing internal temperatures by 20\u00b0C to 25\u00b0C and supporting stable operation up to 400W.
Time to Market: <\/b>Utilizing existing photonics and silicon chips to ensure production readiness without requiring new specialized chips.<\/p>\n

“The evolution of AI workloads requires a fundamental shift in bandwidth and thermal density,” said Richard Xiao<\/span>, VP of Product Marketing at Linktel Technologies. “As a founding member of the XPO MSA, Linktel is proud to lead the definition of these new standards. The 12.8T XPO series shows Linktel’s commitment to delivering flexible, high-performance, and reliable optical solutions for next-generation AI architectures.”<\/p>\n

OFC 2026 Demonstration
<\/b>At Booth #1219, Linktel will demonstrate the 12.8T Liquid-Cooled XPO along with 200G\/lane 1.6T modules, 400G\/lane Optical Engines, and Lightwave Innovation Award-winning Dispersion Management modules.<\/p>\n

About Linktel Technologies
<\/b>Linktel Technologies, with international operation centers and customer service offices in USA, Singapore<\/span>, Malaysia<\/span>, and China<\/span>, provides high-quality products for high-speed optical I\/O connectivity including high speed pluggable transceivers, optical engines, and ODM\/JDM services.<\/p>\n

For more information, visit www.linktel.com<\/span><\/a>.<\/p>\n

\u00a0<\/p>\n

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