{"id":46167,"date":"2026-01-26T22:00:00","date_gmt":"2026-01-26T15:00:00","guid":{"rendered":"https:\/\/thaipropertynews.com\/feeds\/?p=46167"},"modified":"2026-01-26T22:00:00","modified_gmt":"2026-01-26T15:00:00","slug":"jarnistech-qualifies-advanced-hybrid-lamination-process-to-reduce-5g-hardware-bom-costs","status":"publish","type":"post","link":"https:\/\/thaipropertynews.com\/feeds\/?p=46167","title":{"rendered":"JarnisTech Qualifies Advanced Hybrid Lamination Process to Reduce 5G Hardware BOM Costs"},"content":{"rendered":"

SHENZHEN, China<\/span><\/span>, Jan. 26, 2026<\/span><\/span> \/PRNewswire\/ —\u00a0JarnisTech, a specialized PCB manufacturing and assembly provider, today announced the comprehensive qualification of its Hybrid Lamination Solution. This upgraded capability enables the reliable integration of high-frequency materials (such as Rogers or Taconic) with standard FR-4 within a single multilayer board, directly addressing the cost pressures of mass-market 5G infrastructure.<\/p>\n

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\"JarnisTech<\/a>
JarnisTech Hybrid Stack-up: High-Frequency outer layers (grey) on an FR-4 core (green).<\/span><\/p>\n<\/div>\n

By optimizing the ratio of expensive high-speed laminates to standard epoxy glass, the solution allows telecom manufacturers to reduce bare board Bill of Materials (BOM) costs by approximately 30-40% for antenna modules and base stations, without sacrificing RF performance.<\/p>\n

Overcoming CTE Mismatch in Heterogeneous Stacks<\/b><\/p>\n

Hybrid construction has historically faced yield challenges due to the Coefficient of Thermal Expansion (CTE) mismatch between advanced low-loss materials (often PTFE-based) and standard FR-4.<\/p>\n

JarnisTech’s approach mitigates these risks through a proprietary “Dynamic Pressure Profiling” technique. By strictly controlling thermal ramp-up rates and pressure dwell times, the process synchronizes the curing behavior of disparate materials, preventing common defects such as delamination and registration shift.<\/p>\n

“The primary obstacle in hybrid manufacturing is managing the rheology difference between high-frequency resins and standard epoxies,” said Jason Chen<\/span>, Technical Director at JarnisTech. “Through predictive scaling factors and optimized lamination cycles, we can now bond these dissimilar materials while maintaining the strict flatness requirements needed for high-density BGA assembly.”<\/p>\n

Key Technical Validations:<\/b><\/p>\n