{"id":42432,"date":"2025-12-23T14:37:00","date_gmt":"2025-12-23T07:37:00","guid":{"rendered":"https:\/\/thaipropertynews.com\/feeds\/?p=42432"},"modified":"2025-12-23T14:37:00","modified_gmt":"2025-12-23T07:37:00","slug":"rao-tummala-and-industry-leaders-from-ase-tsmc-intel-toyota-and-honda-to-speak-at-nepcon-japans-40th-anniversary","status":"publish","type":"post","link":"https:\/\/thaipropertynews.com\/feeds\/?p=42432","title":{"rendered":"Rao Tummala and Industry Leaders from ASE, TSMC, Intel, Toyota, and Honda to Speak at NEPCON JAPAN’s 40th Anniversary"},"content":{"rendered":"

TOKYO<\/span><\/span>, Dec. 23, 2025<\/span><\/span> \/PRNewswire\/ — As\u00a0NEPCON JAPAN<\/span> approaches its 40th anniversary, RX Japan is gearing up to host an expert-led conference programme<\/b>, featuring the leading voices from across the global electronics and automotive sectors. The event, taking place on<\/span> January 21\u201323, 2026<\/b>, at Tokyo Big Sight<\/b>, will run alongside AUTOMOTIVE WORLD, Factory Innovation Week, and SMART LOGISTICS Expo, creating one of the largest technology gatherings in Asia<\/span> with 1,850 exhibitors across four shows.\u00a0<\/p>\n

\n

\"200 <\/a>
200 Industry Leaders to Speak at NEPCON JAPAN<\/span><\/p>\n<\/div>\n

The conference series at NEPCON JAPAN<\/span> will feature more than 200 sessions addressing critical developments in semiconductors, packaging, and advanced electronics.<\/p>\n

Beginning on January 21<\/span>, Rao Tummala<\/span>,<\/b> widely recognised as the “father of modern electronic packaging” and Emeritus Professor at Georgia Institute of Technology<\/span> and Advisor to the Government of India<\/span>,<\/b> will present “Emergence of Indian Semiconductor Industry for India<\/span> & World,”<\/i> highlighting India’s<\/span> growing role in the global semiconductor supply chain.<\/p>\n

Later that day, Ryutaro Yasuhara<\/span>, Technical Manager at TSMC Japan 3DIC R&D Center, <\/b>will deliver a speech titled “3DIC Technologies to Unleash AI Innovation<\/i>.” There will also be a lecture by Tarek Ibrahim<\/span>, Senior Principal Engineer at Intel Foundry, <\/b>on “Glass Core Substrate Advanced Packaging<\/i>.”<\/p>\n

On January 22<\/span>, Scott Chen<\/span>, Senior Vice President of Central Development Engineering at ASE,<\/b> will deliver a keynote titled “Scaling AI Performance through Advanced Packaging and Power Efficiency.”<\/i> His session will examine how advanced packaging technologies enable AI systems to achieve higher performance while managing power constraints \u2014 a critical challenge for next-generation computing.<\/p>\n

AUTOMOTIVE WORLD, one of the co-located shows, will host specialised sessions on electrification, autonomous driving, and power device technologies, featuring experts from leading automotive and electronics companies such as Toyota Motor, Honda R&D, Nissan Motor, Mazda Motor, Denso,<\/b> The Linux Foundation<\/b>, <\/b>Renesas Electronics<\/b>, Panasonic Automotive Systems<\/b>, among others. These discussions complement NEPCON JAPAN’s<\/span> focus on semiconductor packaging and sensor integration, providing visitors with a comprehensive view of technologies transforming mobility and electronics.<\/p>\n

Registration for NEPCON JAPAN<\/span> 2026 is now open via https:\/\/x.gd\/LTdFp<\/a>. Attendees will gain access to expert-led discussions, the latest technologies, and a network of up to 92,000 industry professionals driving innovation across multiple sectors. For details and to secure your place, visit the official NEPCON JAPAN<\/span> website<\/a>.<\/p>\n

TEL: \u00a0\u00a0 +81-3-6739-4102
E-mail:\u00a0inw.jp@rxglobal.com
<\/a>Web: \u00a0\u00a0 https:\/\/www.nepconjapan.jp\/tokyo\/en-gb.html<\/a><\/p>","protected":false},"excerpt":{"rendered":"

<\/p>\n

TOKYO<\/span><\/span>, Dec. 23, 2025<\/span><\/span> \/PRNewswire\/ — As\u00a0NEPCON JAPAN<\/span> approaches its 40th anniversary, RX Japan is gearing up to host an expert-led conference programme<\/b>, featuring the leading voices from across the global electronics and automotive sectors. The event, taking place on<\/span> January 21\u201323, 2026<\/b>, at Tokyo Big Sight<\/b>, will run alongside AUTOMOTIVE WORLD, Factory Innovation Week, and SMART LOGISTICS Expo, creating one of the largest technology gatherings in Asia<\/span> with 1,850 exhibitors across four shows.\u00a0<\/p>\n

\n

\"200 <\/a>
200 Industry Leaders to Speak at NEPCON JAPAN<\/span><\/p>\n<\/div>\n

The conference series at NEPCON JAPAN<\/span> will feature more than 200 sessions addressing critical developments in semiconductors, packaging, and advanced electronics.<\/p>\n

Beginning on January 21<\/span>, Rao Tummala<\/span>,<\/b> widely recognised as the “father of modern electronic packaging” and Emeritus Professor at Georgia Institute of Technology<\/span> and Advisor to the Government of India<\/span>,<\/b> will present “Emergence of Indian Semiconductor Industry for India<\/span> & World,”<\/i> highlighting India’s<\/span> growing role in the global semiconductor supply chain.<\/p>\n

Later that day, Ryutaro Yasuhara<\/span>, Technical Manager at TSMC Japan 3DIC R&D Center, <\/b>will deliver a speech titled “3DIC Technologies to Unleash AI Innovation<\/i>.” There will also be a lecture by Tarek Ibrahim<\/span>, Senior Principal Engineer at Intel Foundry, <\/b>on “Glass Core Substrate Advanced Packaging<\/i>.”<\/p>\n

On January 22<\/span>, Scott Chen<\/span>, Senior Vice President of Central Development Engineering at ASE,<\/b> will deliver a keynote titled “Scaling AI Performance through Advanced Packaging and Power Efficiency.”<\/i> His session will examine how advanced packaging technologies enable AI systems to achieve higher performance while managing power constraints \u2014 a critical challenge for next-generation computing.<\/p>\n

AUTOMOTIVE WORLD, one of the co-located shows, will host specialised sessions on electrification, autonomous driving, and power device technologies, featuring experts from leading automotive and electronics companies such as Toyota Motor, Honda R&D, Nissan Motor, Mazda Motor, Denso,<\/b> The Linux Foundation<\/b>, <\/b>Renesas Electronics<\/b>, Panasonic Automotive Systems<\/b>, among others. These discussions complement NEPCON JAPAN’s<\/span> focus on semiconductor packaging and sensor integration, providing visitors with a comprehensive view of technologies transforming mobility and electronics.<\/p>\n

Registration for NEPCON JAPAN<\/span> 2026 is now open via https:\/\/x.gd\/LTdFp<\/a>. Attendees will gain access to expert-led discussions, the latest technologies, and a network of up to 92,000 industry professionals driving innovation across multiple sectors. For details and to secure your place, visit the official NEPCON JAPAN<\/span> website<\/a>.<\/p>\n

TEL: \u00a0\u00a0 +81-3-6739-4102
E-mail:\u00a0inw.jp@rxglobal.com
<\/a>Web: \u00a0\u00a0 https:\/\/www.nepconjapan.jp\/tokyo\/en-gb.html<\/a><\/p>\n

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