{"id":41938,"date":"2025-12-18T01:00:00","date_gmt":"2025-12-17T18:00:00","guid":{"rendered":"https:\/\/thaipropertynews.com\/feeds\/?p=41938"},"modified":"2025-12-18T01:00:00","modified_gmt":"2025-12-17T18:00:00","slug":"ap-memory-broadens-s-sicap-technology-deployment-to-support-evolving-ai-and-hpc-needs","status":"publish","type":"post","link":"https:\/\/thaipropertynews.com\/feeds\/?p=41938","title":{"rendered":"AP Memory Broadens S-SiCap\u2122 Technology Deployment to Support Evolving AI and HPC Needs"},"content":{"rendered":"<p><span class=\"legendSpanClass\">HSINCHU<\/span>, Dec. 18, 2025 \/PRNewswire\/ &#8212; AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCap<sup>TM<\/sup> (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCap<sup>TM<\/sup> portfolio includes two product categories \u2014discrete silicon capacitors and interposers with silicon capacitors \u2014 designed to support different system architectures and diverse application requirements.<\/p>\n<p>The discrete silicon capacitors, S-SiCap<sup>TM<\/sup> Gen4, achieves a capacitance density of 3.8 \u03bcF\/mm\u00b2, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap<sup>TM<\/sup> Gen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026.<\/p>\n<p>Meanwhile, the S-SiCap<sup>TM<\/sup> Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I\/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap<sup>TM<\/sup> Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Q3&#8217;25. Additional development projects are currently underway.<\/p>\n<p><span class=\"xn-person\">Ivan Hong<\/span>, President of AP Memory, stated, &#8220;As AI and HPC applications continue to evolve rapidly, the industry is facing increasingly stringent requirements for power integrity and high-speed signal transmission. Through the S-SiCap<sup>TM<\/sup> product line, AP Memory delivers silicon capacitor technology in both discrete components and interposer-integrated forms, providing high performance, high integration, and design flexibility to meet the demands of next-generation AI and HPC systems.&#8221; Looking ahead, AP Memory is actively developing silicon capacitor solutions for organic interposer architectures, further expanding its product portfolio.<\/p>\n<p>About AP Memory<\/p>\n<p>AP Memory (TWSE: 6531) is a global fabless design semiconductor company specializing in customized memory design and IP solutions.\u00a0 Products include IoT memory (IoTRAM<sup>TM<\/sup>), AI memory solutions (VHM<sup>TM<\/sup>), and silicon capacitors (S-SiCap<sup>TM<\/sup>). With strong R&amp;D capabilities, AP Memory is committed to providing high performance, low-power and innovative customized products and solutions for applications such as mobile communication, wearable, IoT, high-end mobile application, high-performance computing, and edge computing.<\/p>\n<p>For more information, please visit\u00a0<a href=\"https:\/\/www.apmemory.com\/\" target=\"_blank\" rel=\"nofollow\">www.apmemory.com<\/a>.<\/p>","protected":false},"excerpt":{"rendered":"<p><!-- wp:html --><\/p>\n<p><span class=\"legendSpanClass\">HSINCHU<\/span>, Dec. 18, 2025 \/PRNewswire\/ &#8212; AP Memory, a leading global design company providing customized memory solutions, today announced further advancements in its S-SiCap<sup>TM<\/sup> (Stack Silicon Capacitor) product line to address the increasing integration demands of AI servers and high-performance computing (HPC) systems. The S-SiCap<sup>TM<\/sup> portfolio includes two product categories \u2014discrete silicon capacitors and interposers with silicon capacitors \u2014 designed to support different system architectures and diverse application requirements.<\/p>\n<p>The discrete silicon capacitors, S-SiCap<sup>TM<\/sup> Gen4, achieves a capacitance density of 3.8 \u03bcF\/mm\u00b2, an increase of more than 50% over the previous generation. To meet the growing demand for higher performance and power efficiency in AI servers and HPC systems, S-SiCap<sup>TM<\/sup> Gen4 is the first to adopt embedded substrate packaging and is currently in the sampling and process validation stage. Mass production will be introduced progressively starting in 2026.<\/p>\n<p>Meanwhile, the S-SiCap<sup>TM<\/sup> Interposer utilizes a silicon wafer as its substrate, embedding high-density silicon capacitors within the interposer. This significantly enhances signal integrity and power stability for high-speed I\/O applications such as die-to-die, SerDes, and HBM. In collaboration with supply-chain partners, AP Memory has introduced a reticle-stitching technology to enlarge interposer die area allowing more IC chiplets to meet the growing demand for higher-integration advanced packaging solutions. The S-SiCap<sup>TM<\/sup> Interposer has completed customer packaging and reliability validation, entering four-reticle mass production at the end of Q3&#8217;25. Additional development projects are currently underway.<\/p>\n<p><span class=\"xn-person\">Ivan Hong<\/span>, President of AP Memory, stated, &#8220;As AI and HPC applications continue to evolve rapidly, the industry is facing increasingly stringent requirements for power integrity and high-speed signal transmission. Through the S-SiCap<sup>TM<\/sup> product line, AP Memory delivers silicon capacitor technology in both discrete components and interposer-integrated forms, providing high performance, high integration, and design flexibility to meet the demands of next-generation AI and HPC systems.&#8221; Looking ahead, AP Memory is actively developing silicon capacitor solutions for organic interposer architectures, further expanding its product portfolio.<\/p>\n<p>About AP Memory<\/p>\n<p>AP Memory (TWSE: 6531) is a global fabless design semiconductor company specializing in customized memory design and IP solutions.\u00a0 Products include IoT memory (IoTRAM<sup>TM<\/sup>), AI memory solutions (VHM<sup>TM<\/sup>), and silicon capacitors (S-SiCap<sup>TM<\/sup>). With strong R&amp;D capabilities, AP Memory is committed to providing high performance, low-power and innovative customized products and solutions for applications such as mobile communication, wearable, IoT, high-end mobile application, high-performance computing, and edge computing.<\/p>\n<p>For more information, please visit\u00a0<a href=\"https:\/\/www.apmemory.com\/\" target=\"_blank\" rel=\"nofollow\">www.apmemory.com<\/a>.<\/p>\n<p><!-- \/wp:html --><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"rop_custom_images_group":[],"rop_custom_messages_group":[],"rop_publish_now":"initial","rop_publish_now_accounts":[],"rop_publish_now_history":[],"rop_publish_now_status":"pending","footnotes":""},"categories":[1],"tags":[],"class_list":["post-41938","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-uncategorized"],"_links":{"self":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts\/41938","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=41938"}],"version-history":[{"count":0,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts\/41938\/revisions"}],"wp:attachment":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=41938"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=41938"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=41938"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}