{"id":23127,"date":"2025-05-12T19:54:59","date_gmt":"2025-05-12T19:54:59","guid":{"rendered":"https:\/\/www.hotelsalepage.com\/feed\/cision-pr-newswire\/er-showcases-advanced-packaging-innovations-at-ieee-ectc-2025-in-texas\/"},"modified":"2025-05-12T19:54:59","modified_gmt":"2025-05-12T19:54:59","slug":"er-showcases-advanced-packaging-innovations-at-ieee-ectc-2025-in-texas","status":"publish","type":"post","link":"https:\/\/thaipropertynews.com\/feeds\/?p=23127","title":{"rendered":"E&amp;R Showcases Advanced Packaging Innovations at IEEE ECTC 2025 in Texas"},"content":{"rendered":"<p><span class=\"legendSpanClass\">KAOHSIUNG<\/span>, <span class=\"legendSpanClass\"><span class=\"xn-chron\">May 12, 2025<\/span><\/span> \/PRNewswire\/ &#8212; E&amp;R Engineering Corp. is excited to participate in the\u00a0<b>75th IEEE Electronic Components and Technology Conference (ECTC)<\/b>, taking place from <b>May 27\u201330, 2025<\/b> at the <b>Gaylord Texan Resort &amp; Convention Center<\/b> in <span class=\"xn-location\">Texas<\/span>.<\/p>\n<p>This year, E&amp;R will highlight its latest solutions in<b> Advanced Packaging,<\/b> including high-precision laser drilling for 2.5D\/3D ICs, multi-beam laser application, and plasma systems with excellent uniformity and thermal stability. E&amp;R will also showcase its comprehensive Flip Chip solution\u2014featuring pre-die bond and pre-underfill plasma cleaning, as well as on-boat\/tray laser marking for high-integrity traceability.<\/p>\n<p>Our <b>Marketing Director <span class=\"xn-person\">Kevin Chang<\/span><\/b> and <b>Sales Supervisor <span class=\"xn-person\">Leo Lee<\/span><\/b>, both with extensive experience in the North American market, will be present to engage with partners and customers.<\/p>\n<p>E&amp;R will be co-exhibiting at the booth of our valued partner <b>Scientech<\/b>. We warmly invite you to visit us and explore how our advanced technologies can help shape the future of semiconductor packaging.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\">\n<p><a href=\"https:\/\/mma.prnasia.com\/media2\/2684693\/E_R.html\" target=\"_blank\" rel=\"nofollow\"><img decoding=\"async\" src=\"https:\/\/mma.prnasia.com\/media2\/2684693\/E_R.jpg?p=medium600\" title=\"E&amp;R Advanced Packaging Solution.\" alt=\"E&amp;R Advanced Packaging Solution.\" \/><\/a><br \/><span>E&amp;R Advanced Packaging Solution.<\/span><\/p>\n<\/div>\n<p><b>Booth Information<\/b><br \/>Booth Number: 438<br \/>Date: May 27\u201330, 2025<br \/>Location: Gaylord Texan Resort &amp; Convention <span class=\"xn-location\">Center, Texas<\/span><br \/>Address:\u00a0 1501 Gaylord Trail, <span class=\"xn-location\">Grapevine, Texas<\/span>, USA, 76051<br \/>Visit us at Scientech&#8217;s Booth!<\/p>\n<p><b>E&amp;R Website: <\/b><a href=\"https:\/\/en.enr.com.tw\/\" target=\"_blank\" rel=\"nofollow\">https:\/\/en.enr.com.tw\/<\/a><\/p>\n<div class=\"PRN_ImbeddedAssetReference\">  <\/div>","protected":false},"excerpt":{"rendered":"<p><!-- wp:html --><\/p>\n<p><span class=\"legendSpanClass\">KAOHSIUNG<\/span>, <span class=\"legendSpanClass\"><span class=\"xn-chron\">May 12, 2025<\/span><\/span> \/PRNewswire\/ &#8212; E&amp;R Engineering Corp. is excited to participate in the\u00a0<b>75th IEEE Electronic Components and Technology Conference (ECTC)<\/b>, taking place from <b>May 27\u201330, 2025<\/b> at the <b>Gaylord Texan Resort &amp; Convention Center<\/b> in <span class=\"xn-location\">Texas<\/span>.<\/p>\n<p>This year, E&amp;R will highlight its latest solutions in<b> Advanced Packaging,<\/b> including high-precision laser drilling for 2.5D\/3D ICs, multi-beam laser application, and plasma systems with excellent uniformity and thermal stability. E&amp;R will also showcase its comprehensive Flip Chip solution\u2014featuring pre-die bond and pre-underfill plasma cleaning, as well as on-boat\/tray laser marking for high-integrity traceability.<\/p>\n<p>Our <b>Marketing Director <span class=\"xn-person\">Kevin Chang<\/span><\/b> and <b>Sales Supervisor <span class=\"xn-person\">Leo Lee<\/span><\/b>, both with extensive experience in the North American market, will be present to engage with partners and customers.<\/p>\n<p>E&amp;R will be co-exhibiting at the booth of our valued partner <b>Scientech<\/b>. We warmly invite you to visit us and explore how our advanced technologies can help shape the future of semiconductor packaging.<\/p>\n<div class=\"PRN_ImbeddedAssetReference\">\n<p><a href=\"https:\/\/mma.prnasia.com\/media2\/2684693\/E_R.html\" target=\"_blank\" rel=\"nofollow\"><img decoding=\"async\" src=\"https:\/\/mma.prnasia.com\/media2\/2684693\/E_R.jpg?p=medium600\" title=\"E&amp;R Advanced Packaging Solution.\" alt=\"E&amp;R Advanced Packaging Solution.\" \/><\/a><br \/><span>E&amp;R Advanced Packaging Solution.<\/span><\/p>\n<\/div>\n<p><b>Booth Information<\/b><br \/>Booth Number: 438<br \/>Date: May 27\u201330, 2025<br \/>Location: Gaylord Texan Resort &amp; Convention <span class=\"xn-location\">Center, Texas<\/span><br \/>Address:\u00a0 1501 Gaylord Trail, <span class=\"xn-location\">Grapevine, Texas<\/span>, USA, 76051<br \/>Visit us at Scientech&#8217;s Booth!<\/p>\n<p><b>E&amp;R Website: <\/b><a href=\"https:\/\/en.enr.com.tw\/\" target=\"_blank\" rel=\"nofollow\">https:\/\/en.enr.com.tw\/<\/a><\/p>\n<div class=\"PRN_ImbeddedAssetReference\">  <\/div>\n<p><!-- \/wp:html --><\/p>\n","protected":false},"author":1,"featured_media":0,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"rop_custom_images_group":[],"rop_custom_messages_group":[],"rop_publish_now":"initial","rop_publish_now_accounts":[],"rop_publish_now_history":[],"rop_publish_now_status":"pending","footnotes":""},"categories":[5,7],"tags":[],"class_list":["post-23127","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-cision-pr-newswire","category-cision-pr-newswire-en"],"_links":{"self":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts\/23127","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fcomments&post=23127"}],"version-history":[{"count":0,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=\/wp\/v2\/posts\/23127\/revisions"}],"wp:attachment":[{"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fmedia&parent=23127"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Fcategories&post=23127"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/thaipropertynews.com\/feeds\/index.php?rest_route=%2Fwp%2Fv2%2Ftags&post=23127"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}