Title sponsorship, 3-day speaking presence at TASA-organized conference\u00a0<\/i><\/p>\n
TAIPEI\u00a0<\/span>, Dec. 1, 2024<\/span><\/span> \/PRNewswire\/ — Hon\u00a0Hai Technology Group (“Foxconn”) (TWSE:2317) kicked off its participation Sunday at the 2nd<\/sup> annual Taiwan International Assembly of Space Science, Technology, and Industry (TASTI), sharing for the first time in-orbit operation technologies from its LEO satellite and the space industry chain footprint of the world’s largest electronics manufacturing service provider.<\/p>\n Future communication technologies will move toward high coverage, high reliability, high connection density, and low latency. TASTI 2024, where Foxconn is a title sponsor, is organized by the Taiwan Space Agency (TASA) that showcases the latest innovation in global space technology.<\/p>\n “We want to spotlight ‘new generation space communications’ and feature the progress of strong collaborations with industry partners to create a comprehensive ecosystem for the satellite industry,” said Dr. Jen-Ming Wu<\/span>, an advisory committee member for TASTI and the Director of the Next-Generation Communications Research Center at Foxconn’s Hon Hai Research Institute.<\/p>\n “We are committed to strongly supporting the development of the space ecosystem, from Taiwan<\/span> to the global stage,” said Jesse Chao<\/span>, Senior Director of Foxconn’s B5G policy group, who will be part of a roundtable on public-private collaborations in the sector.<\/p>\n Foxconn will share a full scale model of the PEARL CubeSat, successfully launched a year ago, and discuss its in-orbit operation technologies, including solar tracking mode, target tracking during ground station flyovers, stable three-axis control, Earth observation, Doppler effect frequency shift compensation for two-way communication, and real space environment experimental data analysis, demonstrating its satellite system integration capabilities.<\/p>\n Also on exhibit will be innovations from the Group’s satellite communications industry chain partnerships: a low-orbit satellite user terminal developed between key group companies, FIH Mobile Ltd and SHARP Corp; an Earth observation camera module from subsidiary Rayprus Holding Ltd; weather-resistant connection harnesses, as well as space-grade connectors and wires produced by Foxconn Interconnect Technology Ltd.<\/p>\n Technology partner MediaTek Inc will show its Software Defined Radio (SDR) chip, which supports Non-Terrestrial Networks (NTNs), while US-based Antaris brings its innovative software platform for space missions.<\/p>\n Find us at TASTI 2024:<\/p>\n\n